Main advantages of LTCC technology

  • High permittivity dielectric materials with very low loss tangent can be used targeting applications up to 100 GHz.

  • Ceramic materials guarantee maximum robustness performance under stringent environmental and mechanical conditions.

  • Better thermal conductivity compared to printed circuit board laminates and thermal coefficient of expansion (TCE) matched to Si and GaAs enabling bare die attaching.

  • Excellent for multi-layer modules in high density of integration application.

  • Embedded passives technology by screen printing of functional materials minimizing the number of SMD components and reducing area and assembly costs.

  • Key enabling technology for System-in-Package (SiP) designs.

  • Cavities, windows and 3-dimensinal forms with complex shapes can be realized.

  • Cost-effective fabrication process specially for medium and high volume.