Main advantages of LTCC technology
- High permittivity dielectric materials with very low loss tangent can be used targeting applications up to 100 GHz.
- Ceramic materials guarantee maximum robustness performance under stringent environmental and mechanical conditions.
- Better thermal conductivity compared to printed circuit board laminates and thermal coefficient of expansion (TCE) matched to Si and GaAs enabling bare die attaching.
- Excellent for multi-layer modules in high density of integration application.
- Embedded passives technology by screen printing of functional materials minimizing the number of SMD components and reducing area and assembly costs.
- Key enabling technology for System-in-Package (SiP) designs.
- Cavities, windows and 3-dimensinal forms with complex shapes can be realized.
- Cost-effective fabrication process specially for medium and high volume.